Physicochemical properties of spherical quartz SiO2 powder
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Overview of spherical quartz SiO2 powder
Spherical quartz SiO2 powder, also known as spherical silica powder, refers to the amorphous quartz powder material in which a single particle is spherical and the main component is silica. It is white powder with uniform particle size, good transparency, good chemical stability, thermal stability and safety. It is insoluble in water.
Spherical quartz powder is mainly used for copper sheet and epoxy plastic packaging in large-scale integrated circuit packaging. It is also used in high-tech fields such as aerospace, fine chemicals and daily cosmetics.
Physicochemical properties of spherical quartz SiO2 powder
Spherical quartz powder has the advantages of smooth surface, large specific surface area, high hardness and stable chemical properties.
Firstly, the spherical powder has good fluidity and can stir evenly with the resin to form a film. The amount of resin added is small and the filling amount of quartz powder is high. The mass fraction can reach 90.5%. The higher the filling amount of quartz powder, the lower the thermal conductivity, the smaller the thermal expansion coefficient of plastic sealing material, and the closer it is to the thermal expansion coefficient of monocrystalline silicon, the better the performance of electronic components produced.
Secondly, the stress of spherical powder is only 60% of that of angular powder. The stress concentration of spherical quartz powder plastic sealing material is the lowest and the strength is the highest. Therefore, when the integrated circuit chip is encapsulated with spherical powder plastic packaging material, the yield is high, and it is not easy to produce mechanical damage in the process of transportation, installation and use.
Third, the spherical powder surface is smooth, the friction coefficient is small, the die wear is small, and the service life of the die can be extended by more than one time.
Application of spherical quartz SiO2 powder
Quartz powder SiO2 is widely used as substrate and packaging material for large-scale or ultra large-scale integrated circuits because of its excellent properties such as high dielectric, heat resistance, moisture resistance, corrosion resistance, high filling rate, low stress, low impurities, low friction coefficient and low price.
In addition, spherical quartz powder can also be widely used in electronic ink, optical fiber, high-grade cosmetics, high-grade precision ceramic manufacturing, precision grinding of optical devices and electronic components, and as special coating filler.
Spherical quartz SiO2 powder is mainly used for high temperature vulcanized silicone rubber, silicone defoamer, preprint ink, powder coating, PVC resin, unsaturated polyester resin thickener, thixotropic agent, pharmaceutical powder, molding preparation, cosmetics, etc. Spherical quartz SiO2 powder is widely used, and its largest application market is its use as electronic packaging material. Electronic packaging is the pillar industry of integrated circuits. With the development of large-scale and very large-scale integrated circuits, integrated circuits become more and more complex, the requirements for packaging materials are higher and higher, and the packaging forms are constantly optimized and updated. The three main materials of electronic packaging are substrate material, plastic packaging material, lead frame and solder. Because plastic packaging has the advantages of low cost, simple process and suitable for mass production, plastic packaging has developed rapidly since its establishment, and its share in packaging is increasing. Now, plastic packaging accounts for 95% of the global integrated circuit market. Among the plastic packaging materials, epoxy plastic packaging material (EMC) is the mainstream of integrated circuit packaging at home and abroad. More than 95% of microelectronic components are encapsulated by epoxy plastic. In microelectronic packaging, it has low moisture resistance and high stress α Radiation, resistance to immersion welding and reflow welding, and good plastic packaging performance. In this regard, epoxy molding compound must add inorganic filler to the resin matrix. At present, almost all inorganic fillers used are fine quartz powder (fine silica powder). With the rapid development of microelectronics industry, large-scale and very large-scale integrated circuits have higher and higher requirements for packaging materials. As an important supporting material of EMC, quartz powder not only requires its particle size to meet the specific packaging range, but also requires its high purity and low content of radioactive elements, especially for the shape of particles.
Price of spherical quartz SiO2 powder
The price of spherical quartz SiO2 powder will change randomly with production cost, transportation cost, international situation and market supply and demand of spherical quartz powder. Tanki new materials Co., Ltd. aims to help all industries and chemical wholesalers find high-quality and low-cost nano materials and chemicals by providing a full range of customized services. If you are looking for spherical quartz SiO2 powder, please feel free to send an inquiry to obtain the latest price of spherical quartz SiO2 powder.
Supplier of spherical quartz SiO2 powder
As a global supplier of spherical quartz powder balls, Tanki new materials Co., Ltd. has rich experience in the performance, application and cost-effective manufacturing of advanced engineering materials. The company has successfully developed a series of powder materials (titanium oxide, silicon oxide, titanium oxide, etc.), high-purity targets, functional ceramics and structural devices, and provided OEM services.
|Technical Parameter of Spherical quartz powder Spherical SiO2：|
|Test Items||Unit||Typical value||Test Method|
|Chemical Composition||SiOB2B||%||99.9||Weight Method|
|Extraction Water||Ec||μS/cm||13||Conductivity Meter|
|Na+||ppm||0.7||Atomic Absorption Spectrometer|
|Cl-||ppm||0.4||Auto Electric Potential Titrator|
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